HY62UF16101C Datasheet, PDF (9/10 Pages) Hynix Semiconductor – 64Kx16bit full CMOS SRAM

HY62UF16101C Series
PACKAGE INFORMATION
48ball Fine-Pitch Ball Grid Array Package(F)
BOTTOM VIEW
B
A
A1 CORNER
INDEX AREA
TOP VIEW
B1/2
6 5 4 3 21
A
A
B
C
D
C
C1
E
F
G
C1/2
C1/2
H
5
C
E
3 D(DIAMETER)
B1/2
SIDE VIEW
A
B1
E1
E2
SEATING PLANE
4
r
Symbol
Min.
A
-
B
-
B1
6.1
C
-
C1
6.2
D
0.3
E
0.9
E1
0.7
E2
0.2
r
-
Typ.
0.75
3.75
6.2
5.25
6.3
0.35
1.0
0.75
0.25
-
Max.
-
-
6.3
-
6.4
0.4
1.1
0.8
0.3
0.1
Note
1. DIMENSIONING AND TOLERANCING PER ASME Y14. SM-1994.
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
Rev.04 /Dec. 00
8