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HY29F800 Datasheet, PDF (22/40 Pages) Hynix Semiconductor – 8 Megabit (1Mx8/512Kx16), 5 Volt-only, Flash Memory
HY29F800
DC CHARACTERISTICS
CMOS Compatible
Par amet er
Des c r ip t io n
Test Setup
Min
Typ
Max Unit
ILI
Input Load Current
ILIT
Input Load Current
A[9], OE#, RESET#
VIN = VSS to VCC,
VCC = VCC Max
VCC = VCC Max, A[9] =
OE# = RESET# =12.5 V
±1.0
µA
35
µA
ILO
Output Leakage Current
VOUT = VSS to VCC,
VCC = VCC Max
CE# = VIL, OE# = VIH,
f = 5MHz, Byte Mode
ICC1
VCC Active Read Current 1, 2 CE# = VIL, OE# = VIH,
f = 5MHz, Word Mode
±1.0
µA
20
40
mA
28
50
mA
ICC2
VCC Active Write Current 2, 3, 4 CE# = VIL, OE# = VIH
30
50
mA
ICC3
VCC CE# Controlled
CMOS Standby Current 2, 5
VCC = VCC Max, CE# =
RESET# = VCC ± 0.5V
0.3
5
µA
ICC4
VCC RESET# Controlled
CMOS Standby Current 2, 5
VCC = VCC Max,
RESET# = VSS ± 0.5V
0.3
5
µA
VIL
Input Low Voltage
-0.5
0.8
V
VIH Input High Voltage
0.7 x VCC
VCC + 0.3 V
VID
Voltage for Electronic ID and
Temporary Sector Unprotect
VCC = 5.0V
11.5
12.5
V
VOL
VOH
VLKO
Output Low Voltage
Output High Voltage
Low VCC Lockout Voltage 3
VCC = VCC Min,
IOL = 5.8 mA
VCC = VCC Min,
IOH = -2.5 mA
VCC = VCC Min,
IOH = -100 µA
0.85 x VCC
VCC - 0.4
3.2
0.45
V
V
V
4.2
V
Notes:
1. The I current is listed is typically less than 2 mA/MHz with OE# at V .
CC
IH
2. Maximum I specifications are tested with V = V Max.
CC
CC
CC
3. ICC active while the Automatic Erase or Automatic Program algorithm is in progress.
4. Not 100% tested.
5. ICC3 = 20 µA maximum for industrial and extended temperature versions.
22
Rev. 4.2/May 01