HY5DU121622BT-5 Datasheet, PDF (21/30 Pages) Hynix Semiconductor – 512Mb(32Mx16) gDDR SDRAM

HY5DU121622BT(P)
ABSOLUTE MAXIMUM RATINGS
Parameter
Ambient Temperature
Storage Temperature
Voltage on Any Pin relative to VSS
Voltage on VDD relative to VSS
Voltage on VDDQ relative to VSS
Output Short Circuit Current
Power Dissipation
Soldering Temperature Þ Time
Symbol
TA
TSTG
VIN, VOUT
VDD
VDDQ
IOS
PD
TSOLDER
Rating
0 ~ 70
-55 ~ 125
-0.5 ~ 3.6
-0.5 ~ 3.6
-0.5 ~ 3.6
50
1
260 Þ 10
Unit
o_C
o_C
V
V
V
mA
W
o_{C Þ sec}
Note : Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITIONS (TA=0 to 70 ^oC, Voltage referenced to VSS = 0V)
Parameter
Power Supply Voltage
Power Supply Voltage
Input High Voltage
Input Low Voltage
Termination Voltage
Reference Voltage
Input Voltage Level, CK and CK
inputs
Input Differential Voltage, CK and CK
inputs
V-I Matching: Pullup to Pulldown
Current Ratio
Input Leakage Current
Output Leakage Current
Output High Voltage
Output Low Voltage
Symbol
VDD
VDDQ
VIH
VIL
VTT
VREF
VIN(DC)
VID(DC)
VI(RATIO)
ILI
ILO
VOH
VOL
Min
2.4
2.4
VREF + 0.15
-0.3
VREF - 0.04
0.49*VDDQ
-0.3
0.36
0.71
-5
-5
VTT + 0.76
-
Typ.
2.5
2.5
-
-
VREF
0.5*VDDQ
VDDQ+0.3
VDDQ+0.6
1.4
5
5
-
VTT - 0.76
Max
2.6
2.6
VDDQ + 0.3
VREF - 0.15
VREF + 0.04
0.51*VDDQ
V
Unit
V
V
V
V
V
V
V
4
-
5
uA
6
uA
V
IOL = -15.2mA
V
IOL = +15.2mA
Note
1
2
3
Note :
1. VDDQ must not exceed the level of VDD.
2. VIL (min) is acceptable -1.5V AC pulse width with < 5ns of duration.
3. VREF is expected to be equal to 0.5*VDDQ of the transmitting device, and to track variations in the dc level of the same.
Peak to peak noise on VREF may not exceed +/- 2% of the DC value
4. VID is the magnitude of the difference between the input level on CK and the input level on /CK.
5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the
entire temper ature and voltage range, for device drain to source voltages from 0.25V to 1.0V. For a given output, it
represents the maximum difference between pullup and pulldown drivers due to process variation. The full variation
in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1/7 for device drain to source
voltages from 0.1 to 1.0.
6. VIN=0 to VDD, All other pins are not tested under VIN =0V. 2. DOUT is disabled, VOUT=0 to VDDQ
Rev. 0.2 / Mar. 2005
21