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HC6856 Datasheet, PDF (12/12 Pages) Honeywell Solid State Electronics Center – 32K x 8 STATIC RAM
HC6856
ORDERING INFORMATION (1)
H
C 6856/1 X
Q
H
Z
C
40
PART NUMBER
Pinout options (2)
PROCESS
C=CMOS
SOURCE
H=HONEYWELL
SCREEN LEVEL (1)
V=QML Class V
Q=QML Class Q
S=Level S
B=Level B
E=Engr Device (4)
SOFT ERROR
RATE
Z=<1x10-10 upsets/bit-day
A=<1x10-9 upsets/bit-day (3)
C=<1x10-7 upsets/bit-day
- =No SER Guaranteed
SPEED (5)
60 ns
40 ns
35 ns
PACKAGE DESIGNATION
W=36-Lead FP
X=36-Lead FP, with standoff
Y=36-Lead FP, with standoff & caps
N=28-Lead FP
R=28-Lead DIP
- = Bare Die (No Package)
TOTAL DOSE
HARDNESS
R=1x105rad(SiO2)
F=3x105 rad(SiO2)
H=1x106 rad(SiO2)
N=No Level Guaranteed
INPUT BUFFER TYPE
C=CMOS Level
T=TTL Level
(1) Orders may be faxed to 612-954-2051. Please contact our Customer Logistics Department at 612-954-2888 for further information.
(2) Pinout options:
36-Lead FP
28-Lead FP & DIP
pin 32 pin 33
pin 34
HC6856/1
A13 CE
NWE JEDEC Pinout
HC6856/2
CE NWE
A13
N/A
(3) SER <1E-10 u/b-d from -55 to 80°C.
(4) Engineering Device description: Parameters are tested from -55 to 125°C, 24 hr burn-in, no radiation guaranteed.
(5) Only specified for Engineering Devices. Number defines worst case maximum Write Cycle time in nano-seconds (ns).
Contact Factory with other needs.
To learn more about Honeywell Solid State Electronics Center,
visit our web site at http://www.ssec.honeywell.com
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability
arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
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