HC6856 Datasheet, PDF (11/12 Pages) Honeywell Solid State Electronics Center – 32K x 8 STATIC RAM

HC6856
28-LEAD FLAT PACK (22017362-001)
E
1
Optional capacitors
in cutout
VDD VSS VDD
b
(width)
L
Q GA
TOP
VIEW
e
(pitch)
Kovar
Lid [4]
Cutout Ceramic
Area
Body
C ^Lead
Alloy 42
S
Z
X
W
BOTTOM
VIEW
Y
V
All dimensions in inches
1
A 0.135 ± 0.015
b 0.015 ± 0.002
C 0.004 to 0.009
D 0.720 ± 0.008
e 0.050 ± 0.005 [1]
E 0.530 ± 0.008
E2 0.420 ± 0.008
E3 0.055 ref
F 0.650 ± 0.005 [2]
G 0.050 ± 0.005
U ^{L 0.295 min [3]}
Q 0.026 to 0.045
S 0.035 ± 0.010
U 0.065 ref
V 0.300 ref
W 0.050 ref
X 0.030 ref
Y 0.100 ref
Z 0.080 ref
E2
E3
[1] BSC - Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
28-LEAD DIP (22017502-001)
For 28-Lead DIP description, see MIL-STD-1835, Type CDIP2-T28, Config. C, Dimensions D-10
DYNAMIC BURN-IN DIAGRAM
STATIC BURN-IN DIAGRAM
VSS
F16
F7
F6
F5
F4
F3
F2
F8
F13
F14
F1
F1
F1
1 _VSS
2 _VDD
R ³ _A14
R ⁴ _A12
R
5 _A7
R
6 _A6
R
7 _A5
R
8 _A4
R
9 _A3
R ¹⁰ A2
R ¹¹ _A1
R ¹² _A0
R ¹³ _DQO
R ¹⁴ _DQ1
R ¹⁵ DQ2
NC ¹⁶
17 _VDD
18 _VSS
VSS
VSS ³⁶
VDD
VDD ³⁵
NWE* ^{34 R}
F0
CE* ^{33 R}
F17
A13* ^{32 R}
F15
A8 ^{31 R}
F12
A9 ^{30 R}
F11
A11 ^{29 R}
F10
NOE ^{28 R}
F17
A10 ^{27 R}
F9
NCS ^{26 R}
F17
DQ7 ²⁵ R
F1
DQ6 ²⁴ R
F1
DQ5 ²³ R
F1
DQ4 ²² R
F1
DQ3 ²¹ R
F1
VDD ²⁰
VSS ¹⁹
VDD = 6.5V, R ≤ 10 KΩ, VIH = VDD, VIL = VSS
Ambient Temperature ≥ 125 °C, F0 ≥ 100 KHz Sq Wave
Frequency of F1 = F0/2, F2 = F0/4, F3 = F0/8, etc.
VSS
1 _VSS
2 _VDD
R
3 _A14
R
4 _A12
R
5 _A7
R
6 _A6
R
7 _A5
R
8 _A4
R
9 _A3
R
10 _A2
R
11 _A1
R
12 _A0
R
13 _DQO
R
14 _DQ1
R
15 _DQ2
16
NC _{17 VDD}
18 _VSS
VSS ³⁶
VDD ³⁵
NWE* ³⁴
CE* ³³
A13* ³²
A8 ³¹
A9 ³⁰
A11 ²⁹
NOE ²⁸
A10 ²⁷
NCS ²⁶
DQ7 ²⁵
DQ6 ²⁴
DQ5 ²³
DQ4 ²²
DQ3 ²¹
VDD ²⁰
VSS ¹⁹
VDD
R
R
R
R
R
R
R
R
R
R
R
R
R
R
VSS
VDD = 5.5V, R ≤ 10 KΩ
Ambient Temperature ≥ 125 °C
NOTE — *Denotes package pinout option dependent (28-Lead DIP/FP diagrams not shown but have similar connections)
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