HI-6130_16 Datasheet, PDF (294/296 Pages) Holt Integrated Circuits – 3.3V BC / MT / RT Multi-Terminal Device

HI-6130, HI-6131
33. PACKAGE DIMENSIONS
HI-6130: 100-PIN PLASTIC QUAD FLAT PACK (PQFP)
16.00
(0.630)
BSC
SQ
14.00
(0.551)
BSC
SQ
millimeters (inches)
Package Type: 100PQS
(00.0.51097)BSC
0.22 ± 0.05
(0.009 ± 0.002)
1.00
(0.039)
typ
See Detail A
(01..06603)max.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0.20
(0.008)
min
1.40 ± 0.05
(0.055 ± 0.002)
(00..00083)R ^min
.024 ± .006
(.60 ± .15)
0.20
(0.008)
R
max
Detail A
0° ≤ Θ ≤ 7°
HI-6131: 64-PIN PLASTIC CHIP-SCALE PACKAGE (QFN) millimeters (inches)
9.00
(0.354)
BSC
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
Package Type: 64PCS
7.25 ± 0.50
(0.285 ± 0.020)
(0.00.15907)BSC
9.00
(0.354)
BSC
Top View
7.25 ± 0.50
(0.285 ± 0.020)
Bottom
View
0.25
(0.10)
typ
1.00
(0.039)
max
0.20
(0.008)
typ
0.40 ± 0.10
(0.016 ± 0.004)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
294