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2SK1666 Datasheet, PDF (3/9 Pages) Hitachi Semiconductor – Silicon N-Channel MOS FET
2SK1666
Electrical Characteristics (Ta = 25°C)
Item
Symbol Min
Drain to source breakdown
voltage
V(BR)DSS 60
Gate to source breakdown
voltage
V(BR)GSS ±20
Gate to source leak current
I GSS
—
Zero gate voltage drain current IDSS
—
Gate to source cutoff voltage VGS(off) 1.0
Static drain to source on state RDS(on) —
resistance
—
Forward transfer admittance |yfs|
20
Input capacitance
Ciss —
Output capacitance
Coss —
Reverse transfer capacitance Crss —
Turn-on delay time
t d(on)
—
Rise time
tr
—
Turn-off delay time
t d(off)
—
Fall time
tf
—
Body to drain diode forward VDF
—
voltage
Body to drain diode reverse trr
—
recovery time
Note: 1. Pulse test
Typ Max Unit
—
—
V
—
—
V
—
±10 µA
—
250 µA
—
2.5
V
0.016 0.02 Ω
0.022 0.035 Ω
32
—
S
3950 —
pF
1920 —
pF
360 —
pF
30
—
ns
180 —
ns
630 —
ns
290 —
ns
1.3
—
V
140 —
ns
Test conditions
ID = 10 mA, VGS = 0
IG = ±100 µA, VDS = 0
VGS = ±16 V, VDS = 0
VDS = 50 V, VGS = 0
ID = 1 mA, VDS = 10 V
ID = 20 A, VGS = 10 V *1
ID = 20 A, VGS = 4 V *1
ID = 20 A, VDS = 10 V *1
VDS = 10 V, VGS = 0,
f = 1 MHz
ID = 20 A, VGS = 10 V,
RL = 1.5 Ω
IF = 45 A, VGS = 0
IF = 45 A, VGS = 0,
diF/dt = 50 A/µs
3