FH26-13S-0.3SHW Datasheet, PDF (8/16 Pages) Hirose Electric – 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors

BRecommended FPC Construction
qContact FPC manufacturer for specific details.
1. Using Single-sided FPC
Connecting side
Material Name
Material
Thickness (µm)
Covering film layer.
Polyamide 1 mil thick.
25
Cover adhesive
25
Surface treatment
Tin-lead plated
5
Copper foil
Cu
1/2oz
35
Base adhesive
Thermosetting adhesive
25
Base film
Polyamide 1 mil thick
25
Reinforcement material adhesive Thermosetting adhesive
40
Stiffener
Polyamide 3 mil thick
75
Total
205
Back side
2. Using Double-sided FPC
Connecting side
Material Name
Covering layer film
Material
Thickness (µm)
Polyamide 1 mil thick
25
Cover adhesive
25
Surface treatment
Tin-lead plated
5
Through-hole copper
Cu
15
Copper foil
Cu
1/2oz
18
Base adhesive
Thermosetting adhesive
18
Base film
Polyamide 1 mil thick
25
Base adhesive
Thermosetting adhesive
18
Copper foil
Cu
1/2oz
18
Cover adhesive
Thermosetting adhesive
25
Back side
Covering layer film
Polyamide 1 mil thick
25
Reinforcement material adhesive Thermosetting adhesive
25
Stiffener
Polyamide 1 mil thick
25
Total
199
qTo prevent release of the FPC due to it's bending, use of double sided FPC with copper foil on the back side is NOT RECOMMENDED.
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