FH26-13S-0.3SHW Datasheet, PDF (7/16 Pages) Hirose Electric – 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors

BRecommended Temperature Profile
qUsing Typical Solder Paste

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HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.'s
Part Number: SENSBY NR-2)
Environment:
:Room air
Solder composition: :Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.'s
Part Number: OZ63-201C-50-9)
Test board
:Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions :0.3mm∞0.65mm,0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may
vary,depending on solder paste type, volume/thickness and
board size/thickness. Consult your solder paste and
equipment manufacturer for specific recommendations.
qUsing Lead-free Solder Paste


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ˆʢTFDʣ
TFD
UP

TFD
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4UBSU
1SFIFBUJOH
4PMEFSJOH


5JNF
4FDPOET
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.'s
Part Number: SENSBY NR-NR-2)
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number: M705-221CM5-42-10.5)
Test board
:Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions :0.3mm∞0.65mm, 0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
7