FH43B Datasheet, PDF (7/12 Pages) Hirose Electric – 0.2 MM PITCH, 0.9 MM ABOVE THE BOARD, FLEXIBLE PRINTED CIRCUIT ZIF CONNECTORS

FH43B Series●0.2 mm Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors
■Temperature Profile
250
200
150
150°C
200°C
MAX 250°C
230°C
HRS test condition
Solder method : Reflow, IR/hot air
Environment :
Room air
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s Part
Number:M705-221CM5-32-10.5)
Test board :
Glass epoxy 100mm×72.5mm×0.8mm thick
Land dimensions : 0.2mm×0.65mm, 0.2mm×0.82mm
Metal mask :
0.18×0.55, 0.18×0.68×0.1mm thick
100
50
25°C _(60sec)
0
Start
90~120sec
Preheating
(60sec)
Soldering
Time(Seconds)
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
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