FH43B Datasheet, PDF (5/12 Pages) Hirose Electric – 0.2 MM PITCH, 0.9 MM ABOVE THE BOARD, FLEXIBLE PRINTED CIRCUIT ZIF CONNECTORS

FH43B Series●0.2 mm Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors
■FHB Series FPC
1. Using Single-sided FPC
Material Name
Covering film layer
Cover adhesive
Surface treatment
Copper foil
Base adhesive
Base film
Reinforcement material adhesive
Stiffener
Material
Polyimide 1 mil thick.
0.2μm thick gold plated over
1 to 6μm nickel underplating
Cu 1/3oz
Thermosetting adhesive
Polyimide 1/2mil thick
Thermosetting adhesive
Polyimide 5 mil thick
Total
Material
Thickness (μm)
(25)
(25)
4
12
10
15
30
125
194
2. Using Double-sided FPC
Material Name
Covering film layer
Cover adhesive
Surface treatment
Through-hole copper
Copper foil
Base adhesive
Base film
Base adhesive
Copper foil
Cover adhesive
Covering film layer
Reinforcement material adhesive
Stiffener
Material
Polyimide 1 mil thick.
0.2μm thick gold plated over
1 to 6μm nickel underplating
Cu
Cu 1/3oz
Thermosetting adhesive
Polyimide 1/2mil thick
Thermosetting adhesive
Cu 1/3oz
Thermosetting adhesive
Polyimide 1/2 mil thick
Thermosetting adhesive
Polyimide 4 mil thick
Total
Material
Thickness (μm)
(25)
(25)
4
12
12
—
13
—
(12)
25
13
25
100
204
* To prevent release of the FPC due to its bending, use of the double sided FPC with copper foil on the back side is NOT RECOMMENDED.
3. Precautions
1. This specification is a recommendation for the construction of the FH43B Series FPC and FFC (t=0.2 ±0.02).
2. For details about the construction, please contact the FPC/FFC manufacturers.
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