FH36 Datasheet, PDF (7/12 Pages) Hirose Electric – 0.3 mm Pitch, 1.0 mm above the board Flexible Printed Circuit ZIF Connectors

FH36 Seriesq0.3 mm Pitch, 1.0 mm above the board Flexible Printed Circuit ZIF Connectors
sTemperature Profile
qUsing Lead-free Solder Paste
250
200
(ç)
150
100
150ç
MAX 250ç
200ç
230ç
50
25ç (60sec.) 90 sec. to 120 sec.
0
Start
Preheating
(60sec.)
Soldering
Time (Seconds)
HRS test condition
Solder method :Reflow, IR/hot air
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-221CM5-32-10.5)
Test board
:Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions :0.3mm∞0.6mm, 0.3mm∞0.8mm
Metal mask
:0.23∞0.5, 0.23∞0.65∞0.1mm thick
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
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