FH36 Datasheet, PDF (5/12 Pages) Hirose Electric – 0.3 mm Pitch, 1.0 mm above the board Flexible Printed Circuit ZIF Connectors

FH36 Seriesq0.3 mm Pitch, 1.0 mm above the board Flexible Printed Circuit ZIF Connectors
sRecommended FPC construction
qContact FPC manufacturer for specific details.
1. Using Single-sided FPC
Connecting side
Back side
Material Name
Material
Material Thickness
(µm)
Covering film layer
Polyamide 1 mil thick.
(25)
Cover adhesive
(25)
Surface treatment
Copper foil
0.2µm thick gold plated over 1 to 5µm
thick nickel underplating
3
Cu
1oz
35
Base adhesive
Thermosetting adhesive
25
Base film
Polyamide 1 mil thick
25
Reinforcement material adhesive Thermosetting adhesive
40
Stiffener
Polyamide 3 mil thick
75
Total
203
2. Using Double-sided FPC
Connecting side
Back side
Material Name
Material
Material Thickness
(µm)
Covering layer film
Polyamide 1 mil thick
(25)
Cover adhesive
Surface treatment
Through-hole copper
0.2µm thick gold plated over 1 to 5µm
thick nickel underplating
Cu
(25)
3
15
Copper foil
Cu
1/2oz
18
Base adhesive
Thermosetting adhesive
18
Base film
Polyamide 1 mil thick
25
Base adhesive
Thermosetting adhesive
18
Copper foil
Cover adhesive
Cu
1/2oz
(18)
Thermosetting adhesive
25
Covering film layer
Polyamide 1 mil thick
25
Reinforcement material adhesive Thermosetting adhesive
25
Stiffener
Polyamide 1 mil thick
25
Total
197
* To prevent release of the FPC due to its bending, use of the double sided FPC with copper foil on the back side is NOT RECOMMENDED.
3.Precautions
1. This specification is a recommendation for the construction of the FH36 Series FPC (t=0.2 ʶ 0.03)
2. For details about the construction, please contact the FPC manufacturers.
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