FX15 Datasheet, PDF (15/24 Pages) Hirose Electric – 1mm Pitch Wire-to-Board Connectors supporting LVDS signal

FX15 Series●1mm Pitch Wire-to-Board Connectors supporting LVDS signal
BRecommended temperature profile
HRS test conditions
250
MAX 250ç
Test board Glass epoxy 40mm∞30mm∞1mm thick
230
Solder method
230ç
: Reflow
Solder composition : Paste
180
180ç
96.5%Sn/3%Ag/0.5%Cu
150
150ç
Metal mask
Reflow cycles
: 0.12mm thick
: 2 cycles
100
The temperature profile is based on the above
conditions.
25
In individual applications the actual temperature
0
90±30sec.
30±10sec.
may vary, depending on solder paste type, volume/
Time (sec.)
thickness and board size/thickness. Consult your
Preheating(150 to 180ç) Sodering
(230çmin)
solder paste and equipment manufacturer for
specific recommendations.
Note : The temperature profile indicates the maximum temperature
of the connector surfaces at the highest point from the PCB
mounting surface.
BWashing Conditions
Organic Solvent Washing
Solvent type
IPA (Isoporopyl alcohol)
Room temperature washing
Yes
Heated washing
Yes
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to
the deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been
performed.
15