GS8160EV18AT Datasheet, PDF (23/24 Pages) GSI Technology – 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs

Preliminary
GS8160EV18/32/36AT-350/333/300/250/225/200/150
Org
Part Number¹
Type
Package
Speed²
(MHz/ns)
T_A3
Status
512K x 36
GS8160EV36AT-350I
DCD Pipeline/Flow Through
TQFP
350/4.5
I
512K x 36
GS8160EV36AT-333I
DCD Pipeline/Flow Through
TQFP
333/4.7
I
512K x 36
GS8160EV36AT-300I
DCD Pipeline/Flow Through
TQFP
300/5
I
512K x 36
GS8160EV36AT-250I
DCD Pipeline/Flow Through
TQFP
250/5.5
I
512K x 36
GS8160EV36AT-200I
DCD Pipeline/Flow Through
TQFP
200/6.5
I
512K x 36
GS8160EV36AT-150I
DCD Pipeline/Flow Through
TQFP
150/7.5
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8160EV18A-.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow through mode-selectable by the user.
3. T_A = C = Commercial Temperature Range. T_A = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00a 6/2003
23/24
© 2003, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.