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MB82DP02183D Datasheet, PDF (32/33 Pages) Fujitsu Component Limited. – 32M Bit (2 M word × 16 bit) Mobile Phone Application Specific Memory | |||
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MB82DP02183D-65L
â BONDING PAD INFORMATION
Please contact local FUJITSU representative for pad layout and pad coordinate information.
â ORDERING INFORMATION
Part Number
MB82DP02183D-65LWT
Shipping Form
Wafer
Remarks
32
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