MB85RS16NPNF-G Datasheet, PDF (22/36 Pages) Fujitsu Component Limited. – 16 K (2 K × 8) Bit SPI

MB85RS16N
(Continued)
8-pin plastic SON
Lead pitch
Package width ×
package length
Sealing method
Mounting height
Weight
0.5 mm
2.0 mm × 3.0 mm
Plastic mold
0.75 mm MAX
0.015g
(LCC-8P-M04)
8-pin plastic SON
(LCC-8P-M04)
2.00±0.07
(.079±.003)
INDEX AREA
3.00±0.07
(.118±.003)
0.05(.002) MAX
0.70±0.05
(.028±.002)
0.15(.006)
C _{2011 FUJITSU SEMICONDUCTOR LIMITED HMbC8-04Sc-1-1}
1.6±0.10
(.063±.004)
1.40±0.10
(.055±.004)
0.50(.020)
TYP
0.40±0.07
(.016±.003)
1PIN CORNER
(C0.30(C.012))
0.25±0.05
(.010±.002)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
22
DS501-00030-3v0-E