MB85R1001_09 Datasheet, PDF (11/12 Pages) Fujitsu Component Limited. – Memory FRAM CMOS 1 M Bit (128 K × 8)

MB85R1001
■ PACKAGE DIMENSIONS
48-pin plastic TSOP(1)
(FPT-48P-M25)
48-pin plastic TSOP(1)
(FPT-48P-M25)
LEAD No. 1
INDEX
Lead pitch
Package width ×
package length
Lead shape
0.50 mm
12.00 × 12.40 mm
Gullwing
Sealing method
Plastic mold
Mounting height
1.20 mm MAX
Weight
Code
(Reference)
0.37 g
P-TSOP(1)48-12×12.4-0.50
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.10±0.05
(.004±.002)
(Stand
off)
48
0.50(.020)
*¹ 12.00±0.10
(.472±.004)
0.22
+0.05
–0.04
.009
+.002
–.002
0.10(.004) M
24
14.00±0.20(.551±.008)
*² _{12.40±0.10(.488±.004)}
0.08(.003)
C _{2003-2009 FUJITSU MICROELECTRONICS LIMITED F48043S-c-2-3}
25
"A"
0.145
+0.05
–0.03
.006
+.002
–.001
1.13±0.07
(.044±.003)
(Mounting
height)
Details of "A" part
0°~8°
0.25(.010)
0.60±0.15
(.024±.006)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
DS05-13103-7E
11