MC9S12H256 Datasheet, PDF (94/130 Pages) Motorola, Inc – Device User Guide

MC9S12H256 Device User Gui^Fde^r—^eeV^s01^c.1^a8 ^{le Semiconductor, Inc.}
TJ = TA + (PD • Θ_JA)
TJ = Junction Temperature, [°C ]
TA = Ambient Temperature, [°C ]
PD = Total Chip Power Dissipation, [W]
Θ_JA = Package Thermal Resistance, [°C/W]
The total power dissipation can be calculated from:
PD = PINT + PIO
PINT = Chip Internal Power Dissipation, [W]
PINT = IDDR ⋅ VDDR + IDDA ⋅ VDDA
∑ ^{PIO =} _i ^{RDSON ⋅ IIOi2}
P_IO is the sum of all output currents on I/O ports associated with VDDX1,2 and VDDM1,2,3.
Table A-5 Thermal Package Characteristics¹
Num C
Rating
Symbol Min
Typ
1 T _{Thermal Resistance LQFP112, single sided PCB}²
θ_JA
–
–
Thermal Resistance LQFP112, double sided PCB
2 T _{with 2 internal planes3}
θ_JA
–
–
3 T Thermal Resistance LQFP 144, single sided PCB
θ_JA
–
–
4
T
Thermal Resistance LQFP 144, double sided PCB
with 2 internal planes
θ_JA
–
–
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
41
45
37
Unit
o_C/W
o_C/W
o_C/W
o_C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
For More Information On This Product,
Go to: www.freescale.com