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MC9S08QE8 Datasheet, PDF (9/46 Pages) Freescale Semiconductor, Inc – 8-Bit HCS08 Central Processor Unit
Electrical Characteristics
1 Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins, except for PTA5 are internally clamped to VSS and VDD.
3 Power supply must maintain regulation within operating VDD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
3.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
Table 4. Thermal Characteristics
Rating
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Single-layer board
32-pin LQFP
28-pin SOIC
20-pin SOIC
16-pin PDIP
16-pin TSSOP
Thermal resistance
Four-layer board
32-pin LQFP
28-pin SOIC
20-pin SOIC
16-pin PDIP
16-pin TSSOP
Symbol
TA
TJM
θJA
Value
Unit
TL to TH
–40 to 85
°C
95
°C
66
57
71
°C/W
64
108
47
42
θJA
52
°C/W
47
78
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
where:
Eqn. 1
MC9S08QE8 Series, Rev. 3
Freescale Semiconductor
Preliminary
9
Subject to Change Without Notice