33882 Datasheet, PDF (8/27 Pages) Freescale Semiconductor, Inc – Six-Output Low-Side Switch with SPI and Parallel Input Control

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Limit
THERMAL RESISTANCE ⁽¹¹⁾, ⁽¹²⁾
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) ⁽¹³⁾
HSOP
QFN
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p) ⁽¹⁴⁾
HSOP
QFN
R_θJA
R_θJMA
°C/W
41
85
°C/W
18
27
Junction-to-Board (Bottom)
HSOP
QFN
Junction-to-Case (Top) ⁽¹⁵⁾
HSOP
QFN
R_θJB
R_θJC
°C/W
3.0
10
°C/W
0.2
1.2
Notes
11. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
12. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
13. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
14. Per JEDEC JESD51-6 with the board horizontal.
15. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC
883, Method 1012.1) with the cold plate temperature used for the case temperature.
33882
8
Analog Integrated Circuit Device Data
Freescale Semiconductor