33882 Datasheet, PDF (22/27 Pages) Freescale Semiconductor, Inc – Six-Output Low-Side Switch with SPI and Parallel Input Control

PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
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PIN ONE ID
2X
1.1
0.9
28X
0.8
B
1.1 MAX x 45˚ ± 5˚
2X
2.7
2.5
1
30
EXPOSED
HEATSINK
AREA
7.3
6.121
4X
1 MAX
4X
1 MAX
16
12.6
15.8
11.7
15
16
11.1
10.9
14.45
A
13.95
0.20 M C B
2.9
2.7
BOTTOM VIEW
3.404 3.3
3 2.9
0.20 C
8˚
MAX
H
DATUM
PLANE
DETAIL Y
C
SEATING
PLANE
0.432
0.35
0.32
0.28
0.23
0.23
0.475
0.35
0.20 M C A
SECTION W−W
0.35
W
GAUGE
PLANE
1.1
0.84
W
30X
0.152
0.025
.127 C
N
(1.6)
DETAIL Y
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
3. DATUM PLANE −H− IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.150 PER SIDE. DIMENSIONS D AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −H−.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. DATUMS −A− AND −B− TO BE DETERMINED AT
DATUM PLANE −H−.
7. DIMENSION D DOES NOT INCLUDE TIEBAR
PROTRUSIONS. ALLOWABLE TIEBAR
PROTRUSIONS ARE 0.150 PER SIDE.
CASE 979A−09
ISSUE H
DATE 02/08/02
DH SUFFIX
30-PIN HSOP
PLASTIC PACKAGE
98ASH70329A
ISSUE H
33882
22
Analog Integrated Circuit Device Data
Freescale Semiconductor