33882 Datasheet, PDF (7/27 Pages) Freescale Semiconductor, Inc – Six-Output Low-Side Switch with SPI and Parallel Input Control

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Limit
ELECTRICAL RATINGS
Load Supply Voltage
Normal Operation (Steady-State)
Transient Survival ⁽¹⁾
Logic Supply Voltage ⁽²⁾
Input Pin Voltage ⁽³⁾
Output Clamp Voltage (OUT0 to OUT5) ⁽⁴⁾
20 mA = I_O = 0.2 A
V
V_PWR(SS)
25
V_PWR(T)
-1.5 to 60
V_DD
-0.3 to 7.0
V
V_IN
-0.3 to V_DD + 0.3
V
V_O(OFF)
V
48 to 64
Output Self-Limit Current
OUT0 to OUT5
OUT6 and OUT7
I_O(LIM)
A
3.0 to 6.0
0.05 to 0.15
ESD Voltage (HSOP and QFN)
Human Body Model ⁽⁵⁾
Machine Model ⁽⁶⁾
Output Clamp Energy ⁽⁷⁾
OUT0 to OUT5: Single Pulse at 1.5 A, T_J = 150°C
OUT6 and OUT7: Single Pulse at 0.45 A, T_J = 150°C
Maximum Operating Frequency (SPI) SO ⁽⁸⁾
THERMAL RATINGS
V_ESD1
V_ESD2
E_CLAMP
f_OF
±2000
±200
100
50
3.2
V
mJ
MHz
Storage Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow ⁽⁹⁾, ⁽¹⁰⁾
T_STG
T_J
T_PPRT
-55 to 150
°C
-40 to 150
°C
Note 10.
°C
Notes
1. Transient capability with external 100 Ω resistor in series with V_PWR pin and supply.
2. Exceeding these voltages may cause a malfunction or permanent damage to the device.
3. Exceeding the limits on any parallel inputs or SPI pins may cause permanent damage to the device.
4. With output OFF.
5. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP=100 pF, R_ZAP=1500 Ω).
6. ESD2 testing is performed in accordance with the Machine Model (C_ZAP=200 pF, R_ZAP=0 Ω).
7. Maximum output clamp energy capability at indicated junction temperature using a single pulse method.
8. Serial Frequency Specifications assume the IC is driving 8 tri-stated devices (20 pF each).
9. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
10. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33882
7