33887 Datasheet, PDF (7/37 Pages) Freescale Semiconductor, Inc – 5.0 A H-Bridge with Load Current Feedback

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage ⁽¹⁾
Input Voltage ⁽²⁾
FS Status Output ⁽³⁾
Continuous Current ⁽⁴⁾
DH Suffix HSOP ESD Voltage ⁽⁵⁾
V+
V_IN
V _FS
I_OUT
-0.3 to 40
V
- 0.3 to 7.0
V
-0.3 to 7.0
V
5.0
A
V
Human Body Model
Each Pin to AGND
Each Pin to PGND
Each Pin to V+
Each I/O to All Other I/Os
Machine Model
VW Suffix HSOP, SOICW-EP, and PQFN ESD Voltage ⁽⁵⁾
Human Body Model
Machine Model
THERMAL RATINGS
V_ESD1
V_ESD1
V_ESD1
V_ESD1
V_ESD2
V_ESD1
V_ESD2
±1000
±1500
±2000
±2000
±200
V
± 2000
± 200
Storage Temperature
Operating Temperature ⁽⁶⁾
Ambient
Junction
Peak Package Reflow Temperature During Reflow ⁽⁷⁾, ⁽⁸⁾
T_STG
T_A
T_J
T_PPRT
- 65 to 150
°C
°C
- 40 to 125
- 40 to 150
Note 8.
°C
Notes
1 Performance at voltages greater than 28V is degraded.See Electrical Performance Curves on page 18 and 19 for typical performance.
Extended operation at higher voltages has not been fully characterized and may reduce the operational lifetime.
2 Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device.
3 Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device.
4 Continuous current capability so long as junction temperature is ≤ 150°C.
5 ESD1 testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω).
6 The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
nonrepetitive excursions of junction temperature above 150°C can be tolerated as long as duration does not exceed 30 seconds
maximum. (nonrepetitive events are defined as not occurring more than once in 24 hours.)
7 Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33887
7