33887 Datasheet, PDF (34/37 Pages) Freescale Semiconductor, Inc – 5.0 A H-Bridge with Load Current Feedback

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
A
Tab
AGND 1
FS 2
IN1 3
V+ 4
V+ 5
OUT1 6
OUT1 ⁷
FB 8
PGND 9
PGND 10
20
EN
19
IN2
18
D1
17
C_CP
16
V+
15
OUT2
14
OUT2
13
D2
12
PGND
11
PGND
Tab
33887 Pin Connections
20-Pin HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
Figure 26. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 8. Thermal Resistance Performance
Thermal Resistance
Area A (mm²)
°C/W
R_θJA
0.0
52
300
36
600
32
R_θJS
0.0
10
300
7.0
600
6.0
R_θJA is the thermal resistance between die junction and
ambient air.
R_θJS is the thermal resistance between die junction and the
reference location on the board surface near a center lead of the
package (see Figure 26).
33887
34
Analog Integrated Circuit Device Data
Freescale Semiconductor