33887 Datasheet, PDF (33/37 Pages) Freescale Semiconductor, Inc – 5.0 A H-Bridge with Load Current Feedback

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33887 technical
data sheet. The addendum provides thermal performance information that may
be critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
The MC33887 is offered in a 20 pin HSOP exposed pad, single die package.
There is a single heat source (P), a single junction temperature (T_J), and thermal
resistance (R_θJA).
T_J = _RθJA . _P
33887DH
20-PIN
HSOP-EP
DH SUFFIX
98ASH70273A
20-PIN HSOP-EP
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Note For package dimensions, refer to
the 33887 device data sheet.
Standards
Table 7. Thermal Performance Comparison
Thermal Resistance
R_θJA^(1),(2)
R_θJB ^(2),(3)
R_θJA ^{(1), (4)}
R_θJC ⁽⁵⁾
[°C/W]
20
6.0
52
1.0
NOTES:
1.Per JEDEC JESD51-2 at natural convection, still air condition.
2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7.
3.Per JEDEC JESD51-8, with the board temperature on the center
trace near the center lead.
4.Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.Thermal resistance between the die junction and the exposed
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated
1.0
1.0
0.2
0.2
* All measurements
are in millimeters
Soldermast
openings
20 Terminal HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
Thermal vias
connected to top
buried plane
Figure 25. Thermal Land Pattern for Direct Thermal
Attachment According to JESD51-5
Analog Integrated Circuit Device Data
Freescale Semiconductor
33887
33