33887 Datasheet, PDF (26/37 Pages) Freescale Semiconductor, Inc – 5.0 A H-Bridge with Load Current Feedback

PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
The 33887 packages are designed for thermal
.
performance. The significant feature of these packages is the
exposed pad on which the power die is soldered. When
soldered to a PCB, this pad provides a path for heat flow to
the ambient environment. The more copper area and
thickness on the PCB, the better the power dissipation and
transient behavior will be.
Example Characterization on a double-sided PCB:
bottom side area of copper is 7.8 cm²; top surface is 2.7 cm²
(see Figure ); grid array of 24 vias 0.3 mm in diameter
Top Side
Bottom Side
Figure 24. PCB Test Layout
33887
26
Analog Integrated Circuit Device Data
Freescale Semiconductor