MSC8251_11 Datasheet, PDF (65/68 Pages) Freescale Semiconductor, Inc – Single-Core Digital Signal Processor

5 Package Information
Package Information
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURE PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DETERMINED BY THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
6. ALL DIMENSIONS ARE SYMMETRIC ACROSS THE PACKAGE CENTER LINES, UNLESS DIMENSIONED
OTHERWISE.
7. 29.2MM MAXIMUM PACKAGE ASSEMBLY (LID + LAMINATE) X AND Y.
Figure 40. MSC8251 Mechanical Information, 783-ball FC-PBGA Package
MSC8251 Single-Core Digital Signal Processor Data Sheet, Rev. 6
Freescale Semiconductor
65