MC9RS08KA8 Datasheet, PDF (6/40 Pages) Freescale Semiconductor, Inc – MCU Block Diagram

Electrical Characteristics
This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised
that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this
high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for
instance, V_SS or V_DD) or the programmable pull-up resistor associated with the pin is enabled.
Table 3. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to 5.8
V
Maximum current into VDD
IDD
120
mA
Digital input voltage
VIn
–0.3 to VDD + 0.3
V
Instantaneous maximum current
Single pin limit (applies to all port pins)^{1, 2, 3}
ID
±25
mA
Storage temperature range
Tstg
–55 to 150
°C
1 _{Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,}
calculate resistance values for positive (V_DD) and negative (V_SS) clamp voltages, then use the larger of the two
resistance values.
2 _{All functional non-supply pins are internally clamped to VSS and VDD except the RESET/VPP pin which is internally}
clamped to VSS only.
3 _{Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum}
current conditions. If positive injection current (V_In > V_DD) is greater than I_DD, the injection current may flow out of V_DD
and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater
than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are:
if no system clock is present, or if the clock rate is very low which would reduce overall power consumption.
3.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits and it
is user-determined rather than being controlled by the MCU design. In order to take P_I/O into account in power calculations,
determine the difference between actual pin voltage and V_SS or V_DD and multiply by the pin current for each I/O pin. Except
in cases of unusually high pin current (heavy loads), the difference between pin voltage and V_SS or V_DD will be very
small.
Table 4. Thermal Characteristics
Rating
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance 16-pin PDIP
Thermal resistance 16-pin SOIC
Thermal resistance 20-pin PDIP
Thermal resistance 20-pin SOIC
Symbol
T_A
T_JMAX
θ_JA
θ_JA
θ_JA
θ_JA
Value
T_L to T_H
–40 to 85
105
80
112
75
96
Unit
°C
°C
°C/W
°C/W
°C/W
°C/W
The average chip-junction temperature (TJ) in °C can be obtained from:
where:
T_A = Ambient temperature, °C
T_J = T_A + (P_D × θ_JA)
Eqn. 1
MC9RS08KA8 Series, Rev. 1
6
Preliminary—Subject to Change Without Notice
Freescale Semiconductor