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MC33999 Datasheet, PDF (4/21 Pages) Motorola, Inc – 16-Output Switch with SPI and PWM Control
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VPWR Supply Voltage (1)
SPI Interface Logic Supply Voltage (1)
SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST, PWMn) (1)
Output Drain Voltage
Frequency of SPI Operation (2)
Output Clamp Energy (3)
ESD Voltage (4)
Human Body Model
Machine Model
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
Storage Temperature
Power Dissipation (TA = 25°C) (5)
Peak Package Reflow Temperature During Reflow (6), (7)
Thermal Resistance
Junction-to-Ambient (8)
Junction- to-Lead (9)
Junction-to-Flag
VPWR
SOPWR
VIN
VDS
fSPI
ECLAMP
VESD1
VESD2
TA
TJ
TC
TSTG
PD
TPPRT
RθJA
RθJL
RθJC
-1.5 to 50
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 45
6.0
50
±2000
±200
-40 to 125
-40 to 150
-40 to 125
-55 to 150
1.7
Note 7
75
8.0
1.2
V
V
V
V
MHz
mJ
V
°C
°C
W
°C
°C/W
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. This parameter is guaranteed by design but not production tested.
3. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.
4. ESD data is available upon request. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500
Ω) and the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
5. Maximum power dissipation with no heat sink used.
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
8. Tested per JEDEC test JESD52-2 (single-layer PWB).
9. Tested per JEDEC test JESD51-8 (two-layer PWB).
33999
4
Analog Integrated Circuit Device Data
Freescale Semiconductor