English
Language : 

K22P48M50SF4 Datasheet, PDF (2/55 Pages) Freescale Semiconductor, Inc – K22 Sub-Family Data Sheet
Table of Contents
1 Ordering parts...........................................................................3
5.4.1 Thermal operating requirements...........................20
1.1 Determining valid orderable parts......................................3
5.4.2 Thermal attributes.................................................20
2 Part identification......................................................................3
6 Peripheral operating requirements and behaviors....................21
2.1 Description.........................................................................3
6.1 Core modules....................................................................21
2.2 Format...............................................................................3
6.1.1 JTAG electricals....................................................21
2.3 Fields.................................................................................3
6.2 System modules................................................................24
2.4 Example............................................................................4
6.3 Clock modules...................................................................24
3 Terminology and guidelines......................................................4
6.3.1 MCG specifications...............................................24
3.1 Definition: Operating requirement......................................4
6.3.2 Oscillator electrical specifications.........................26
3.2 Definition: Operating behavior...........................................5
6.3.3 32 kHz Oscillator Electrical Characteristics...........29
3.3 Definition: Attribute............................................................5
6.4 Memories and memory interfaces.....................................29
3.4 Definition: Rating...............................................................6
6.4.1 Flash electrical specifications................................29
3.5 Result of exceeding a rating..............................................6
6.4.2 EzPort Switching Specifications............................32
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................33
requirements......................................................................6
6.6 Analog...............................................................................33
3.7 Guidelines for ratings and operating requirements............7
6.6.1 ADC electrical specifications.................................34
3.8 Definition: Typical value.....................................................7
6.6.2 CMP and 6-bit DAC electrical specifications.........38
3.9 Typical value conditions....................................................8
6.6.3 Voltage reference electrical specifications............40
4 Ratings......................................................................................9
6.7 Timers................................................................................41
4.1 Thermal handling ratings...................................................9
6.8 Communication interfaces.................................................41
4.2 Moisture handling ratings..................................................9
6.8.1 USB electrical specifications.................................41
4.3 ESD handling ratings.........................................................9
6.8.2 USB DCD electrical specifications........................42
4.4 Voltage and current operating ratings...............................9
6.8.3 VREG electrical specifications..............................42
5 General.....................................................................................10
6.8.4 DSPI switching specifications (limited voltage
5.1 AC electrical characteristics..............................................10
range)....................................................................42
5.2 Nonswitching electrical specifications...............................10
6.8.5 DSPI switching specifications (full voltage range).44
5.2.1 Voltage and current operating requirements.........11
6.8.6 I2C switching specifications..................................46
5.2.2 LVD and POR operating requirements.................11
6.8.7 UART switching specifications..............................46
5.2.3 Voltage and current operating behaviors..............12
6.8.8 Normal Run, Wait and Stop mode performance
5.2.4 Power mode transition operating behaviors..........13
over the full operating voltage range.....................46
5.2.5 Power consumption operating behaviors..............14
6.8.9 VLPR, VLPW, and VLPS mode performance
5.2.6 EMC radiated emissions operating behaviors.......17
over the full operating voltage range.....................48
5.2.7 Designing with radiated emissions in mind...........18
7 Dimensions...............................................................................50
5.2.8 Capacitance attributes..........................................18
7.1 Obtaining package dimensions.........................................50
5.3 Switching specifications.....................................................18
8 Pinout........................................................................................50
5.3.1 Device clock specifications...................................18
8.1 K22 Signal Multiplexing and Pin Assignments..................50
5.3.2 General switching specifications...........................19
8.2 K22 Pinouts.......................................................................52
5.4 Thermal specifications.......................................................20
9 Revision History........................................................................54
K22 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.
2
Freescale Semiconductor, Inc.