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K10P144M120SF3 Datasheet, PDF (2/75 Pages) Freescale Semiconductor, Inc – K10 Sub-Family Data Sheet
Table of Contents
1 Ordering parts...........................................................................3
5.4.2 Thermal attributes.................................................21
1.1 Determining valid orderable parts......................................3
6 Peripheral operating requirements and behaviors....................22
2 Part identification......................................................................3
6.1 Core modules....................................................................22
2.1 Description.........................................................................3
6.1.1 Debug trace timing specifications.........................22
2.2 Format...............................................................................3
6.1.2 JTAG electricals....................................................23
2.3 Fields.................................................................................3
6.2 System modules................................................................25
2.4 Example............................................................................4
6.3 Clock modules...................................................................25
3 Terminology and guidelines......................................................4
6.3.1 MCG specifications...............................................25
3.1 Definition: Operating requirement......................................4
6.3.2 Oscillator electrical specifications.........................28
3.2 Definition: Operating behavior...........................................4
6.3.3 32kHz Oscillator Electrical Characteristics............30
3.3 Definition: Attribute............................................................5
6.4 Memories and memory interfaces.....................................31
3.4 Definition: Rating...............................................................5
6.4.1 Flash (FTFE) electrical specifications...................31
3.5 Result of exceeding a rating..............................................6
6.4.2 EzPort Switching Specifications............................34
3.6 Relationship between ratings and operating
6.4.3 NFC specifications................................................34
requirements......................................................................6
6.4.4 Flexbus Switching Specifications..........................38
3.7 Guidelines for ratings and operating requirements............6
6.5 Security and integrity modules..........................................40
3.8 Definition: Typical value.....................................................7
6.6 Analog...............................................................................40
3.9 Typical value conditions....................................................8
6.6.1 ADC electrical specifications.................................40
4 Ratings......................................................................................8
6.6.2 CMP and 6-bit DAC electrical specifications.........49
4.1 Thermal handling ratings...................................................8
6.6.3 12-bit DAC electrical characteristics.....................51
4.2 Moisture handling ratings..................................................9
6.6.4 Voltage reference electrical specifications............54
4.3 ESD handling ratings.........................................................9
6.7 Timers................................................................................55
4.4 Voltage and current operating ratings...............................9
6.8 Communication interfaces.................................................55
5 General.....................................................................................9
6.8.1 CAN switching specifications................................55
5.1 AC electrical characteristics..............................................10
6.8.2 DSPI switching specifications (limited voltage
5.2 Nonswitching electrical specifications...............................10
range)....................................................................56
5.2.1 Voltage and current operating requirements.........10
6.8.3 DSPI switching specifications (full voltage range).57
5.2.2 LVD and POR operating requirements.................11
6.8.4 I2C switching specifications..................................59
5.2.3 Voltage and current operating behaviors..............12
6.8.5 UART switching specifications..............................59
5.2.4 Power mode transition operating behaviors..........13
6.8.6 SDHC specifications.............................................59
5.2.5 Power consumption operating behaviors..............14
6.8.7 I2S/SAI Switching Specifications..........................60
5.2.6 EMC radiated emissions operating behaviors.......18
6.9 Human-machine interfaces (HMI)......................................62
5.2.7 Designing with radiated emissions in mind...........19
6.9.1 TSI electrical specifications...................................62
5.2.8 Capacitance attributes..........................................19
7 Dimensions...............................................................................63
5.3 Switching specifications.....................................................19
7.1 Obtaining package dimensions.........................................64
5.3.1 Device clock specifications...................................19
8 Pinout........................................................................................64
5.3.2 General switching specifications...........................20
8.1 K10 Signal Multiplexing and Pin Assignments..................64
5.4 Thermal specifications.......................................................21
8.2 K10 Pinouts.......................................................................71
5.4.1 Thermal operating requirements...........................21
9 Revision History........................................................................73
K10 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
2
Preliminary
Freescale Semiconductor, Inc.