MRF7S19120NR1_09 Datasheet, PDF (13/14 Pages) Freescale Semiconductor, Inc – RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET

PRODUCT DOCUMENTATION, TOOLS AND SOFTWARE
Refer to the following documents to aid your design process.
Application Notes
• AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
• AN3789: Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages
Engineering Bulletins
• EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
• Electromigration MTTF Calculator
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part's Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
0
1
2
Date
Sept. 2007
Jan. 2009
Dec. 2009
Description
• Initial Release of Data Sheet
• Updated Fig. 14, CCDF W-CDMA 3GPP, Test Model 1, 64 DPCH, 50% Clipping, Single-Carrier Test
Signal, to better represent production test signal, p. 8
• Updated Fig. 16, Series Equivalent Source and Load Impedance, large signal Z_source impedance
parameters to better reflect measured values, p. 9
• Updated Charge Device Model ESD from Class IV to III to reflect actual Qual Report results, p. 2
• Fig. 14, CCDF W-CDMA IQ Magnitude Clipping, Single-Carrier Test Signal and Fig. 15, Single-Carrier
W-CDMA Spectrum updated to show the undistorted input test signal, p. 8
• Added AN1907, Solder Reflow Attach Method for High Power RF Devices in Plastic Packages and
AN3789, Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages to Product
Documentation, Application Notes, p. 13
• Added Electromigration MTTF Calculator availability to Product Software, p. 13
RF Device Data
Freescale Semiconductor
MRF7S19120NR1
13