56F8033 Datasheet, PDF (118/157 Pages) Freescale Semiconductor, Inc – 16-bit Digital Signal Controllers

Table 10-2 56F8033/56F8023 ESD Protection
Characteristic
Min
Typ
Max
Unit
ESD for Machine Model (MM)
200
—
—
V
ESD for Charge Device Model (CDM)
750
—
—
V
Table 10-3 LQFP Package Thermal Characteristics⁶
Characteristic
Comments
Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Junction to ambient
Natural convection
Junction to ambient
(@200 ft/min)
Junction to ambient
(@200 ft/min)
Junction to board
Junction to case
Junction to package top
Single layer board
(1s)
Four layer board
(2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
R_θJA
R_θJMA
R_θJMA
R_θJMA
R_θJB
R_θJC
Ψ_JT
41
°C/W
34
°C/W
34
°C/W
29
°C/W
24
°C/W
8
°C/W
2
°C/W
Notes
2
1, 2
2
1, 2
4
3
5
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p
thermal test board.
2. Junction to ambient thermal resistance, Theta-JA (R_θJA), was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (R_θJC), was simulated to be equivalent to the measured values using the cold plate
technique with the cold plate temperature used as the “case” temperature. The basic cold plate measurement technique is de-
scribed by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
4. Junction to board thermal resistance, Theta-JB (R_θJB), is a metric of the thermal resistance from the junction to the printed circuit
board determined per JESD51-8. Board temperature is measured on the top surface of the board near the package.
5. Thermal Characterization Parameter, Psi-JT (Y_JT), is the “resistance” from junction to reference point thermocouple on top center
of case as defined in JESD51-2. Y_JT is a useful value to use to estimate junction temperature in steady state customer
environments.
6. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
7. See Section 12.1 for more details on thermal design considerations.
56F8033/56F8023 Data Sheet, Rev. 6
118
Freescale Semiconductor