MCIMX53XA Datasheet, PDF (1/180 Pages) Freescale Semiconductor, Inc – i.MX53xA Automotive and Infotainment Applications Processors

Freescale Semiconductor
Data Sheet: Advance Information
This document contains information on a new
product. Specifications and information herein
are subject to change without notice.
i.MX53xA Automotive
and Infotainment
Applications
Processors
Document Number: IMX53AEC
Rev. 1, 3/2011
MCIMX53xA
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3
1 Introduction
The MCIMX53xA (i.MX53xA) automotive
infotainment processor is Freescale Semiconductor’s
latest addition to a growing family of
multimedia-focused products offering high performance
processing with a high degree of functional integration
aimed at the growing automotive infotainment,
telematics, HMI, and display-based cluster markets. This
device includes 3D and 2D graphics processors, 1080i/p
video processing, and dual display, and provides a
variety of interfaces.
The i.MX53xA processor features Freescale’s advanced
implementation of the ARM™ core, which operates at
clock speeds as high as 800 MHz and interfaces with
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800
DRAM memories. This device is well-suited for
graphics rendering for HMI and navigation, high
performance speech processing with large databases,
video processing and display, audio playback, and many
other applications.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Power Supplies Requirements and Restrictions . 24
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 27
4.4. Output Buffer Impedance Characteristics . . . . . . 34
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 43
4.7. External Peripheral Interfaces Parameters . . . . . . 64
4.8. XTAL and CKIL Electricals . . . . . . . . . . . . . . . . . 151
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 152
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 152
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 153
5.3. Power setup during Boot . . . . . . . . . . . . . . . . . . 154
6. Package Information and Contact Assignments . . . . . 155
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 155
6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 174
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
The flexibility of the i.MX53xA architecture allows for
its use in a wide variety of applications. As the heart of
the application chipset, the i.MX53xA processor
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© 2011 Freescale Semiconductor, Inc. All rights reserved.