FAN54013_12 Datasheet, PDF (5/36 Pages) Fairchild Semiconductor – FAN54010 / FAN54011 / FAN54012 / FAN54013 / FAN54014

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum
ratings are stress ratings only.
Symbol
Parameter
V_BUS VBUS Voltage
Continuous
Pulsed, 100 ms Maximum Non-Repetitive
V_STAT
V_I
STAT Voltage
PMID Voltage
SW, CSIN, VBAT, AUXPWR, DISABLE Voltage
V_O
Voltage on Other Pins
dV_BUS
dt
Maximum V_BUS Slope above 5.5 V when Boost or Charger are Active
ESD
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
T_J
T_STG
T_L
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Note:
4. Lesser of 6.5 V or V_I + 0.3 V.
Min.
–1.4
–2.0
–0.3
–0.3
–0.3
Max.
20.0
16.0
7.0
7.0
6.5⁽⁴⁾
4
2000
500
–40
+150
–65
+150
+260
Unit
V
V
V
V
V/s
V
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
V_BUS
V_BAT(MAX)

dV_BUS
dt
T_A
T_J
Supply Voltage
Maximum Battery Voltage when Boost enabled
Negative VBUS Slew Rate during VBUS Short Circuit,
C_MID < 4.7 µF (see VBUS Short While Charging)
T_A < 60°C
T_A > 60°C
Ambient Temperature
Junction Temperature (see Thermal Regulation and Protection section)
Min.
4
–30
–30
Max.
6
4.5
4
2
+85
+120
Unit
V
V
V/s
°C
°C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
T_J(max) at a given ambient temperature T_A. For measured data, see Table 11.
Symbol
_JA
_JB
Parameter
Junction-to-Ambient Thermal Resistance
Junction-to-PCB Thermal Resistance
Typical
60
20
Unit
°C/W
°C/W
© 2011 Fairchild Semiconductor Corporation
FAN5401X Family • Rev. 1.0.4
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