FAN5069_08 Datasheet, PDF (4/22 Pages) Fairchild Semiconductor – PWM and LDO Controller Combo

Absolute Maximum Ratings
The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The
device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are
not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the condi-
tions for actual device operation. ⁽¹⁾
Parameter
V_CC to PGND
BOOT to PGND
SW to PGND
Continuous
Transient (t < 50nS, F < 500kHz)
HDRV (V_BOOT- – V_SW)
LDRV
All Other Pins
Maximum Shunt Current for V_CC
Electrostatic Discharge Protection (ESD)
Level⁽²⁾
HBM
CDM
Min.
-0.5
-3.0
-0.5
-0.3
3.5
1.8
Max.
6.0
33.0
33.0
33.0
6.0
6.0
V_CC + 0.3
150
Unit
V
V
V
V
V
V
V
mA
kV
Notes:
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at these or any conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are referenced to AGND.
2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Thermal Information
Symbol
Parameter
T_STG
T_L
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Vapor Phase, 60 Seconds
Infrared, 15 Seconds
P_D
Power Dissipation, T_A = 25°C
θ_JC Thermal Resistance, Junction-to-Case
θ_JA
Thermal Resistance, Junction-to-Ambient⁽³⁾
Min.
-65
Typ.
37
100
Max.
150
300
215
220
715
Unit
°C
°C
°C
°C
mW
°C/W
°C/W
Notes:
3. Junction-to-ambient thermal resistance, θ_JA, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat
sink characteristics.
Recommended Operating Conditions
Symbol
Parameter
V_CC
Supply Voltage
T_A
Ambient Temperature
T_J
Junction Temperature
Conditions
V_CC to GND
Commercial
Industrial
Min.
4.5
-10
-40
Typ.
5.0
Max.
5.5
85
85
125
Unit
V
°C
°C
°C
© 2005 Fairchild Semiconductor Corporation
FAN5069 Rev. 1.1.5
4
www.fairchildsemi.com