FAB2210 Datasheet, PDF (34/35 Pages) Fairchild Semiconductor – Audio Subsystem with Class-G Headphone and 3.3W Mono Class-D Speaker with Dynamic Range Compression

Physical Dimensions
BALL A1
INDEX AREA
0.03 C
2X
E
AF
B
D
TOP VIEW
0.03 C
2X
1.20
A1
Ø0.20
Cu Pad
1.60 _0.40
Ø0.30 Solder
Mask Opening
0.40
RECOMMENDED LAND PATTERN
(NSMD TYPE)
0.05 C
0.06 C
0.625
0.547
E
0.378±0.018
0.208±0.021
C
SEATING PLANE
SIDE VIEWS
D
1.20
0.40
1.60
0.40
1234
0.005 C A B
Ø0.260±0.02
20X
E
D
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC020AArev2.
External Product Dimensions
Product
FAB2210UCX
D
1.96mm
E
1.96mm
X
0.018mm
Y
0.018mm
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Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel
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© 2011 Fairchild Semiconductor Corporation
FAB2210 • Rev. 1.1.1
34
www.fairchildsemi.com