FAB2200 Datasheet, PDF (32/33 Pages) Fairchild Semiconductor – Audio Subsystem with Stereo Class-G Headphone Amplifier and 1.2W Mono Class-D Speaker Amplifier

Physical Dimensions
0.03 C
2X
E
AF
B
BALL A1
INDEX AREA
D
TOP VIEW
0.03 C
2X
1.60
A1
0.40
1.60 _0.40
(Ø0.200)
Cu Pad
(Ø0.300)
Solder Mask
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.05 C
0.06 C
0.625
0.547 _E
C
D
SEATING PLANE
SIDE VIEWS
0.378±0.018
0.208±0.021
1.60 _0.40
1.60
0.40
1234 5
0.005 C A B
Ø0.260±0.02
25X
E
D
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC025AArev2.
Figure 27. 25-Bump, 0.4mm Pitch, Wafer-Level Chip-Scale Package (WLCSP)
Product
FAB2200UCX
D
2.06mm
E
2.38mm
X
0.39mm
Y
0.23mm
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© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
32
www.fairchildsemi.com