FAB2200 Datasheet, PDF (1/33 Pages) Fairchild Semiconductor – Audio Subsystem with Stereo Class-G Headphone Amplifier and 1.2W Mono Class-D Speaker Amplifier

June 2011
FAB2200
Audio Subsystem with Stereo Class-G Headphone
Amplifier and 1.2W Mono Class-D Speaker Amplifier
Features
 Single Supply: 2.8V – 5.25V
 Pop and Click Suppression
 Differential or Single-Ended Audio Inputs
 Rejects TDMA Noise from GSM Handsets
 Filterless Fully Differential Class-D Speaker
Amplifier
 Programmable Edge-Rate Control and Spread
Spectrum Minimize EMI
 1.2W into 8Ω at 4.2V, THD+N < 10%
 970mW into 8Ω at 4.2V, THD+N < 1%
 90% Efficiency
 Automatic Gain Control Limits Distortion and
Protects Speakers at All Battery Voltages
 Noise Gate Improves Audio Quality
 Headphone Amplifier
 Power-Saving Class-G Operation
 Audio Taper I²C Volume Control
 Capacitor-Free Outputs
 Integrated Regulated Charge Pump
 SGND Pin Eliminates Ground-Loop Noise
 Noise Gate Improves Audio Quality
 DPST Analog Bypass Switch
 I²C Control
 Low-Power Shutdown Mode
 Current Limit and Thermal Protection
 25-Bump, 0.4mm Pitch WLCSP Package
Description
The FAB2200 combines a capacitor-free stereo
headphone amplifier with a monolithic class-D
speaker amplifier.
An integrated charge pump generates multiple supply
rails for a ground-centered class-G headphone
output. The charge pump is regulated for high Power
Supply Rejection Ratio (PSRR).
The filterless class-D amplifier can be connected
directly to a speaker without external filters.
The programmable Automatic Gain Control (AGC)
limits maximum speaker output levels to protect
speakers without introducing distortion. It can also
dynamically limit clipping as the battery voltage falls.
The noise gate can automatically mute the speaker or
headphone amplifiers to reduce noise when input
signals are low.
Applications
 Cellular Handsets
 Notebook Computers
 Tablet PCs
Ordering Information
Part Number
FAB2200UCX
Operating Temperature Range
-40 to +85°C
Package
25-Bump, 0.4mm Pitch, Wafer-Level
Chip-Scale Package (WLCSP)
Packing Method
3000 Units on
Tape & Reel
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com