FMT1000 Datasheet, PDF (28/29 Pages) Fairchild Semiconductor – Motion Tracking Module with Output of Orientation, Inertial Motion Data and Magnetic Field

8.3 Packaging
The FMT1000-series module is shipped in trays or reels. Trays containing 20 modules, according to the configuration
below. Reels contain 250 modules. Other quantities and packaging methods are available on request. Packaging
details can be found in the packaging specification PKG-FMT28TA on www.fairchildsemi.com.
Figure 19. Tray Containing 20ea FMT1000-Series Modules
Reels are packaged according to the specification in PKG-FMT28RA, available on www.fairchildsemi.com.
8.4 Reflow Specification
The moisture sensitivity level of the FMT1000-series modules corresponds to JEDEC MSL Level 3, see also:
 IPC/JEDEC J-STD-020E “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for non-hermetic
Solid State Surface Mount Devices”
 IPC/JEDEC J-STD-033C “Joint Industry Standard: Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices”.
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard, i.e. reflow
soldering with a peak temperature up to 260°C. Recommended Preheat Area (ts) is 80-100 sec. The minimum height
of the solder after reflow shall be at least 50 µm. This is required for good mechanical decoupling between the
FMT1000-series module and the Printed Circuit Board (PCB) it is mounted on. Assembled PCB‟s may NOT be
cleaned with ultrasonic cleaning.
© 2015 Fairchild Semiconductor Corporation
FMT1000-series • Rev. 1.0
Figure 20. Reflow Profile
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