English
Language : 

FGK60N6S2D Datasheet, PDF (2/9 Pages) Fairchild Semiconductor – 600V, SMPS II Series N-Channel IGBT with Anti-Parallel StealthTM Diode
Package Marking and Ordering Information
Device Marking
60N6S2D
Device
FGK60N6S2D
Package
TO-247
Tape Width
N/A
Quantity
30
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Off State Characteristics
BVCES Collector to Emitter Breakdown Voltage IC = 250µA, VGE = 0
600
ICES Collector to Emitter Leakage Current VCE = 600V TJ = 25°C
-
TJ = 125°C -
IGES Gate to Emitter Leakage Current
VGE = ± 20V
-
-
-
V
-
250
µA
-
3
mA
-
±250 nA
On State Characteristics
VCE(SAT) Collector to Emitter Saturation Voltage IC = 40A,
TJ = 25°C
-
1.9
2.5
V
VGE = 15V
TJ = 125°C
-
1.65 2.2
V
VEC
Diode Forward Voltage
IEC = 40A
-
2.1
2.6
V
Dynamic Characteristics
QG(ON) Gate Charge
VGE(TH)
VGEP
Gate to Emitter Threshold Voltage
Gate to Emitter Plateau Voltage
IC = 40A,
VGE = 15V
-
VCE = 300V VGE = 20V
-
140
175
nC
180
228
nC
IC = 250µA, VCE = VGE
3.5
4.3
5.0
V
IC = 40A, VCE = 300V
-
6.5
8.0
V
Switching Characteristics
SSOA Switching SOA
td(ON)I
trI
td(OFF)I
tfI
EON1
EON2
EOFF
td(ON)I
trI
td(OFF)I
tfI
EON1
EON2
EOFF
trr
Current Turn-On Delay Time
Current Rise Time
Current Turn-Off Delay Time
Current Fall Time
Turn-On Energy (Note 2)
Turn-On Energy (Note 2)
Turn-Off Energy (Note 3)
Current Turn-On Delay Time
Current Rise Time
Current Turn-Off Delay Time
Current Fall Time
Turn-On Energy (Note 2)
Turn-On Energy (Note 2)
Turn-Off Energy (Note 3)
Diode Reverse Recovery Time
TJ = 150°C, RG = 3Ω, VGE = 200
-
15V, L = 100µH, VCE = 600V
-
A
IGBT and Diode at TJ = 25°C, -
18
-
ns
ICE =40A,
-
15
-
ns
VCE = 390V,
VGE = 15V,
RG =3Ω
L = 100µH
-
70
-
ns
-
50
-
ns
-
400
-
µJ
Test Circuit - Figure 26
-
490
-
µJ
-
310 450
µJ
IGBT and Diode at TJ = 125°C -
ICE = 40A,
-
VCE = 390V,
-
VGE = 15V,
RG = 3Ω
-
L = 100µH
-
Test Circuit - Figure 26
-
27
-
ns
32
-
ns
110 150
ns
77
90
ns
400 450
µJ
750 850
µJ
-
688 950
µJ
IEC =40A, dIEC/dt = 200A/µs
-
IEC = 1A, dIEC/dt = 200A/µs
-
75
90
ns
50
60
ns
Thermal Characteristics
RθJC Thermal Resistance Junction-Case
IGBT
Diode
-
-
0.2 °C/W
0.75 °C/W
NOTE:
2ao.sfVtthaheleueIIGGsBBfoTTr.otTwnhloye.TEduOironNd-2Oeinstytlpohesesistucsronpn-edocintiifoileondsssianwrfehigesunhroeaw2tny6p.foicratlhdeiocdoenvisenuiseendceinotfhtehetecsitrccuirictuditeasnigdnethr.eEdOioNd1eisisthaet
turn-on loss
the same TJ
3tJh.EeTDuiErnnpC-uOStfftpauEnlnsdeearrgadynNdLooe.sn2sd4i(-nE1gOMaFeFt )tthhioseddpfeoofirinnMtewdeahasesuretrhetemheienntcetogollrfeaPcl otoowfretchrueDrrienevsnittcaeenqTtauunarenlso-OuzesffrpSoow(wIiCtecErhi=lnogs0sALs)o.tsaAsr.ltliTndhgeivsaitcteethsstewmtreeartiehlinotgedspeterdodgdepueocr-f
es the true total Turn-Off Energy Loss.
©2002 Fairchild Semiconductor Corporation
FGK60N6S2D Rev. A1