|
FAN3100_09 Datasheet, PDF (2/21 Pages) Fairchild Semiconductor – Single 2A High-Speed, Low-Side Gate Driver | |||
|
◁ |
Ordering Information
Part Number
Input
Threshold
Eco Status
Package
Packing Method Quantity / Reel
FAN3100CMPX
FAN3100CSX
FAN3100TMPX
FAN3100TSX
CMOS
CMOS
TTL
TTL
Green
RoHS
Green
RoHS
6-Lead 2x2mm MLP
5-Pin SOT23
6-Lead 2x2mm MLP
5-Pin SOT23
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
3000
3000
3000
3000
For Fairchildâs definition of âgreenâ Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package Outlines
IN+ 1
AGND 2
VDD 3
6 IN
5 PGND
4 OUT
Figure 3. 2x2mm 6-Lead MLP (Top View)
Figure 4. SOT23-5 (Top View)
Thermal Characteristics(1)
Package
ÎJL(2) ÎJT(3) ÎJA(4) ΨJB(5) ΨJT(6) Units
6-Lead 2x2mm Molded Leadless Package (MLP)
2.7
133
58
2.8
42
°C/W
SOT23-5
56
99
157
51
5
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (ÎJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3. Theta_JT (ÎJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4. Theta_JA (ÎJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and
JESD51-7, as appropriate.
5. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2.
6. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.
© 2007 Fairchild Semiconductor Corporation
FAN3100 ⢠Rev. 1.0.2
2
www.fairchildsemi.com
|
▷ |