FXLA2203 Datasheet, PDF (15/16 Pages) Fairchild Semiconductor – Dual-Mode, Dual-SIM-Card Level Translator

Physical Dimensions
0.10 C
2X
2.50
AB
PIN #1 IDENT
3.40
TOP VIEW
0.10 C
2X
0.10 C
0.55 MAX.
0.08 C
0.05
0.00
SIDE VIEW
0.15
SEATING
PLANE
C
7
23X
0.35
0.45
13
0.40
1
0.45
24
0.55
19
0.15
0.25
24X
BOTTOM VIEW
0.10 C A B
0.05 C
0.66
2.80
2.23
24
19
0.56
1
0.40
2.23 3.70
13
7
0.23
RECOMMENDED LAND PATTERN
Figure 18. 24-Terminal 2.5mm x 3.4mm Ultrathin Molded Leadless Package (UMLP)
Product-Specific Dimensions
Description
Overall Height
PKG Standoff
Lead Thickness
Lead Width
Nominal Values (mm)
0.50
0.012
0.15
0.20
Description
Lead Length
Lead Pitch
Body Length (X)
Body Width (Y)
Nominal Values (mm)
0.40
0.40
2.50
3.40
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without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packaging/MicroMLP24_TNR.pdf.
© 2010 Fairchild Semiconductor Corporation
FXLA2203 • Rev. 1.0.5
15
www.fairchildsemi.com