FXLA2203 Datasheet, PDF (1/16 Pages) Fairchild Semiconductor – Dual-Mode, Dual-SIM-Card Level Translator

August 2012
FXLA2203
Dual-Mode, Dual-SIM-Card Level Translator
Features
 Easy-to-Use “Single Pin” SIM Card Swap Control
 Channel Swap Time: 130ns (Typical)
 Simultaneous Dual-Mode, Dual-SIM Communication
 Host Ports: 1.65V to 3.6V Voltage Translation
 Card Ports: 1.65V to 3.6V Voltage Translation
 Leverages the Presence of Existing PMIC LDOs
 ISO7816 Compliant
 Power Switch R_ON: 0.5Ω (Typical)
 Supports Class B 3V SIM / UIM Cards
 Supports Class C: 1.8V SIM / UIM Cards
 Non-Preferential Host V_CC Power-Up Sequencing
 Activation / Deactivation Timing Compliant
per ISO7816-03
 Internal Pull up Resistors for Bi-Directional I/O Pin
 Outputs Switch to 3-State if Host V_CC at GND
 Power-Off Protection
 Packaged in 24-Terminal UMLP (2.5mm x 3.5mm)
 Direction Control Not Needed
Applications
 Dual-Mode Dual-SIM Applications
 GSM, CDMA, WCDMA, TDSCDMA CDMA2000,
3G Cellular Phones
 Mobile TV: OMA BCAST
Description
The FXLA2203 allows either two hosts to
simultaneously communicate with two Subscriber
Identity Modules (SIM), or two User Identity Modules
(UIM). Dual Mode refers to the mobile phones that are
compatible with more than one form of data
transmission or network (such as GSM, CDMA,
WCDMA, TDSCDMA, or CDMA2000), resulting in a
dual-baseband processor configuration. In a dual-mode
application, the FXLA2203 host ports interface directly
with the baseband processors (see Figure 9).
The bi-directional I/O open-drain channel features auto-
direction and internal 10KΩ pull-up resistors. RST and CLK
provide unidirectional translation from host to card only.
Either host can swap SIM slots with the assertion of a
single control pin: CH_Swap. The typical channel swap
time is 130ns.
The FXLA2203 does not contain internal Low Dropout
Regulator (LDOs). Instead, the FXLA2203 architecture
incorporates two low-R_ON internal power switches for
routing existing PMIC (Power Management Integrated
Circuit) LDOs to individual SIM slots. This reduces
overall system power, leverages existing LDO system
resources, and aligns with the philosophy that
centralizing LDOs in the PMIC facilitates power
management. Since the FXLA2203 does not block the
LDO function to the SIM card, existing activation /
deactivation timing transparency is maintained between
Hosts, PMICs, and SIM cards.
The device allows voltage translation from as high as
3.6V to as low as 1.65V. Each port tracks its own port
power supply.
Ordering Information
Part Number
Operating
Temperature Range
FXLA2203UMX
-40 to 85°C
Package
24-Terminal, 2.5mm x 3.4mm Ultrathin Molded
Leadless Package (UMLP), 0.4mm Pitch
Packing
Method
Tape and Reel
© 2010 Fairchild Semiconductor Corporation
FXLA2203 • Rev. 1.0.5
www.fairchildsemi.com