TCS37717FN Datasheet, PDF (42/48 Pages) List of Unclassifed Manufacturers – The benefits and features of the TCS3771 are listed below

TCS3771 − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The FN package has been assigned a moisture sensitivity level
of MSL 3 and the devices should be stored under the following
conditions:
• Temperature Range: 5°C to 50°C
• Relative Humidity: 60% maximum
• Total Time: 12 months from the date code on the
aluminized envelope - if unopened
• Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 12 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking
is required, it should be done at 50°C for 12 hours.
Page 42
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ams Datasheet, Confidential
[v1-20] 2014-Aug-06