TCS37717FN Datasheet, PDF (41/48 Pages) List of Unclassifed Manufacturers – The benefits and features of the TCS3771 are listed below

TCS3771 − Manufacturing Information
Manufacturing Information
Figure 49:
TCS310x Solder Reflow Profile
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217°C (T1)
Time above 230°C (T2)
Time above T_peak - 10°C (T3)
Peak temperature in reflow
Temperature gradient in cooling
Reference
t_soak
t₁
t₂
t₃
T_peak
TCS310x
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C
Max -5°C/sec
Figure 50:
Solder Reflow Profile Graph
Note(s) and/or Footnote(s):
1. Not to scale - for reference only.
ams Datasheet, Confidential
[v1-20] 2014-Aug-06
Page 41
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