TCS37717FN Datasheet, PDF (39/48 Pages) List of Unclassifed Manufacturers – The benefits and features of the TCS3771 are listed below

TCS3771 − Packaging Mechanical Data
Packaging Mechanical Data
Figure 47:
Package FN - Dual Flat No-Lead Packaging Configuration
Note(s) and/or Footnote(s):
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerance of ±75μm.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
ams Datasheet, Confidential
[v1-20] 2014-Aug-06
Page 39
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