OXFW911 Datasheet, PDF (6/32 Pages) List of Unclassifed Manufacturers – IEEE1394 to ATA/ATAPI Native Bridge

OXFORD SEMICONDUCTOR LTD.
OXFW911
14, 7, 39, 47, 55, 67, 75, 93, 96,
106, 112,
29, 25, 26, 83, 87, 118
Other
1, 122
GND AC GND
GND DC GND
NC
Supplies GND to output buffers in switching (AC) state
Ground (0 volts). Supplies GND to core logic, input buffers
and output buffers in steady state
No Connect
Note 1: Direction key:
I
Input
IU
Input with internal pull-up
ID
Input with external pull-down
O
Output
I/O
Bi-directional
T_I
5V tolerant input
Table 1: Pin Descriptions
T_O
T_I/O
GND
VDD
NC
5V tolerant output
5V tolerant bi-directional
Ground
3.3V power
No Connect
Note 2: Power & Ground
There are two GND and two VDD rails internally. One set of rails supply power and ground to output buffers while in switching
state (called AC power) and another rail supply the core logic, input buffers and output buffers in steady-state (called DC rail).
The rails are not connected internally. This precaution reduces the effects of simultaneous switching outputs and undesirable RF
radiation from the chip.
Data Sheet Rev 1.1
Page 6