GMM-U1 Datasheet, PDF (35/36 Pages) List of Unclassifed Manufacturers – GPS Module

GlobalTop Technology
Gmm-u1 Data Sheet
35 _{Ver. V0G}
9. Module must be pre-baked before going through SMT solder reflow process.
10. The usage of solder paste should follow “first in first out” principle. Opened solder
paste needs to be monitored and recorded in a timely fashion (can refer to IPQC for
related documentation and examples).
11. Temperature and humidity must be controlled in SMT production line and storage
area. Temperature of 23°C, 60±5% RH humidity is rec ommended. (please refer to
IPQC for related documentation and examples)
12. When performing solder paste printing, please notice if the amount of solder paste is
in excess or insufficient, as both conditions may lead to defects such as electrical
shortage, empty solder and etc.
13. The reflow temperature and its profile data must be measured before the SMT
process and match the levels and guidelines set by IPQC.
6.3 Manual Soldering
Soldering iron:
Bit Temperature: Under 380°C
Time: Under 3 sec.
Notes:
1. Please do not directly touch the soldering pads on the surface of the PCB board, in
order to prevent further oxidation
2. The solder paste must be defrosted to room temperature before use so it can return
to its optimal working temperature. The time required for this procedure is unique and
dependent on the properties of the solder paste used.
3. The steel plate must be properly assessed before and after use, so its measurement
stays strictly within the specification set by SOP.
4. Please watch out for the spacing between soldering joint, as excess solder may
cause electrical shortage
5. Please exercise with caution and do not use extensive amount of flux due to possible
siphon effects on neighboring components, which may lead to electrical shortage.
6. Please do not use the heat gun for long periods of time when removing the shielding
or inner components of the GPS module, as it is very likely to cause a shift to the
inner components and will leads to electrical shortage.
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